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Home > Products >Digital Images |
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Features |
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KB Products Service
KB service currently provides printed eutectic (63Sn/37Pb), high lead
(90/10), low alpha (< 0.02 cph/cm2)
eutectic solder bumping on 6” and 8” silicon wafers. The
capacity will be 30000 pcs/month by the end of 2001. The fine-pitch
capability of printed eutectic solder bumping is 160um for area array
and 150um for peripheral type of devices.
To improve joint reliability and process yield of the wafer bumping
on very fine peripheral bond pad, the redistribution process is needed.
Redistribution technology, which allows the re-layout of the interconnection
from the locations of peripheral bond pads to new area pad array without
changing the die design. This method widens the very fine pad pitch,
and allows wider under bump metallurgy (UBM) for larger bumps. The
advantages are extended thermal cycle fatigue life, better underfill
flow, and greater tolerance of board flatness variation. ASEs redistribution
process will be in service by 2001 Q3.
Other bumping processes, like the electroplated Au bumping which are
targeted at the LCD drivers by tape automated bonding (TAB) or tape
carrier package (TCP), will be ready in 2001 Q3. |
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Wafer Bumping Outgoing Criteria |
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Test item |
Condition |
Sample size |
Criteria |
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Bump height |
Optical Microscope (500X)
or
Bump Height Scanner |
25bumps/wafer
5 wafers/lotX3 |
Bump height?5um |
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Shear strength |
Blade 25 um height &
Shear speed 175 um/sec |
5 bumps/wafer
5 wafers/lotX3 |
> 2g / (mil2
of UBM area) |
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Void detection |
X-ray Photography |
250 bumps/wafer
2 wafers/lotX3 |
All voids must be
30% smaller than
bump diameter for
eutectic solder bump |
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Final inspection |
Automatic Inspection
Tool & Microscope (50X) |
100%inspection
(August tool) Manual
Sample Inspection |
Following ASE
Workmanship Standard |
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